Patel explains TSMC and Intel achieved seven nanometer manufacturing using older DUV lithography with multi-patterning technique.
“TSMC and Intel were able to do it with what's called multi patterning DUV, deep ultraviolet. Right? So that just means they use the DUV lithography many times, right, for simplicity's sake.”
Patel explains TSMC found DUV superior to EUV for seven nanometer on yield, cost, and performance after trying both.
“TSMC tried both. Right? And so at six nanometer and five nanometer, they use EUV, but they think cost efficiency wise, yield, right, which is how good the product's coming out, how many are good, how many need to be thrown away, the yield is better, the cost is better, the performance is better with DUV rather than EUV.”